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CLEARFIL™ SE BOND 2 is the future-proof successor of Kuraray’s clinically proven self-etch adhesive CLEARFIL™ SE BOND. It offers the same clinical benefits as CLEARFIL™ SE BOND (e.g. outstanding marginal sealing and virtually no postoperative sensitivity) plus a higher bond strength to dentin and an extended range of indications. The adhesive may be used for bonding direct, indirect and core build-up restorations. It is available in multi-dose bottles and unit-dose vials which may be used according to individual preferences.
CLEARFIL™ SE BOND 2 is composed of a mild self-etching primer with a low techniquesensitivity and a light-curing bonding agent with a high sealing ability. For all direct indications,the two components are applied as usual. In order to bond core build-ups and indirectrestorations, the bonding agent of CLEARFIL™ SE BOND 2 is just mixed with a single drop of anadditional component, the CLEARFIL™ DC Activator. In this way, a reliable, long-lasting bond tocore build-up composites like CLEARFIL™ DC CORE PLUS and adhesive resin cements isobtained.
Direct procedures:• Bonding of direct restorations made of light-curing composite resin• Cavity sealing as a pretreatment for indirect restorations• Treatment of exposed root surfaces and hypersensitive teeth• Cavity sealing as a pretreatment for indirect restorations
Innovative curing technologies in CLEARFIL™ SE BOND 2 ensure that the adhesive curesquickly and creates a durable seal – no matter if used alone or in combination with theCLEARFIL™ DC Activator. Light-cure acceleration is based on an innovative photo initiatorcontained in the adhesive. Self-cure acceleration is achieved by a catalyst thatinitiates polymerization of the cement or core build-up material at the very moment it touchesthe bond-activator mixture. Both procedures result in a tight and durable marginal seal.
Cementation workflows can be simplified by replacing the cementation primer by CLEARFIL™SE BOND 2. Mixing the BOND with CLEARFIL™ DC Activator results in the perfect film thickness.This is an important precondition for precisely fitting inlays, onlays, crowns and bridges.
With CLEARFIL™ SE BOND 2, neither a separate acid etching nor a rinsing step are necessary. Additionally, less attention to the surface moisture level has to be given: The risk of over-wetting or over-drying of the preparation is very low e.g. compared to wet bonding systems. This leads to a low technique sensitivity and simplified application compared to etch-and-rinse adhesives.
*Before applying the PRIMER, selective enamel etch by phosphoric acid is an option.
*Before applying the PRIMER, selective enamel etch by phosphoric acid is an option.**Light-curing the mixture is an option for optimum performance.
CLEARFIL™ SE BOND 2 contains the Original MDP Monomer, an essential component of any adhesive product from Kuraray Noritake. Having been in use for more than 35 years, MDP offers a proven excellence in adhesion. The hydrophilic group of the adhesive monomer forms a strong chemical bond with calcium and hydroxylapatite. Since hydroxylapatite crystals remain in the hybrid layer after mild self-etching, a stable hybrid layer is formed by the adhesive. In addition, a strong bond to enamel is ensured.